High density interconnects (HDI) are defined as substrates or boards with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100mm), smaller vias (<150mm) and capture pads (<400mm), and higher connection pad density (>20 pads/cm2) than employed in conventional PCB tec...
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High density interconnects (HDI) are defined as substrates or boards with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100mm), smaller vias (<150mm) and capture pads (<400mm), and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI is used to reduce size and weight, as well as to enhance electrical performance.
In addition to HDI, terms such as "build-up board" in Japan and "sequential build-up (SBU)" or "microvia technology" in the U.S. can be used interchangeably.
In addition to HDI, terms such as "build-up board" in Japan and "sequential build-up (SBU)" or "microvia technology" in the U.S. can be used interchangeably.
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