Multilayer Ml8–Logic and power on same pcb with fine pitch - Produto
MODENA -
Itália
Application:
Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A...
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A...
Descrição de Produto
Application:
Automotive hybrid car
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig
Technology: Multilayer Ml8–Logic and power on same pcb with fine pitch
Layup: Mixed copper thickness 210 µm, 35 µm in the innerlayer and 105 µm on outer layer
Material: Fr4 High Tg with filler Iteq IT180A
Finishing: Enig
Preço de Produto
Preço não indicado