Technology: Multilayer SBU with 5+N+5 with Cu filled vias
Material: Polyamide + CopperInvarCopper
Finishing: Enig + cavity with Electrolityc Nickel
Descrição de Produto
Technology: Multilayer SBU with 5+N+5 with Cu filled vias
Material: Polyamide + CopperInvarCopper
Finishing: Enig + cavity with Electrolityc Nickel